Recently, the Beijing Science and Technology Program, jointly developed by the Institute of Semiconductors of the Chinese Academy of Sciences and the University of Chinese Academy of Sciences, passed the acceptance test for the development of 5mm×5mm semiconductor diamond substrate materials. Diamond is an ultra-wide bandgap semiconductor material with excellent carrier mobility, large carrier saturation drift rate, strong breakdown field and high thermal conductivity. It is a high-frequency and high-power electronic device and deep ultraviolet optoelectronic device. Ideal material for high performance devices such as quantum spin devices. Internationally, Japan, Europe, and the United States are internationally leading in the field of semiconductor diamond materials research, and domestic research on semiconductor diamond materials has just started. With the support of the Beijing Science and Technology Program, the research team mastered the MPCVD and RFCVD technologies for the preparation of high-quality semiconductor diamond single crystal materials, and developed the first diamond electrical property testing device in China. The semiconductor single crystal diamond material was prepared at room temperature. The electron and hole mobility exceeds 4100 cm2/V•s and 3700 cm2/V•s, respectively, which is close to the highest international report, which is the best level in the country. At the same time, through the implementation of the project, a research system including semiconductor diamond material growth equipment, growth process, test characterization equipment and test characterization methods was established. Next, the research team plans to carry out a small test process for semiconductor diamond single crystal substrates.
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Abstract Recently, the Beijing Science and Technology Project “Development of 5mm×5mm Semiconductor Diamond Substrate Materials†jointly undertaken by the Institute of Semiconductors of the Chinese Academy of Sciences and the University of Chinese Academy of Sciences passed the acceptance test. Diamond is an ultra-wide bandgap semiconductor material with high carrier mobility, carriers...